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DAN222 Common Cathode Silicon Dual Switching Diode
This Common Cathode Silicon Epitaxial Planar Dual Diode is designed for use in ultra high speed switching applications. This device is housed in the SOT-416/SC-90 package which is designed for low power surface mount applications, where board space is at a premium.
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CATHODE 3
* Fast trr * Low CD * Pb-Free Packages are Available
1 ANODE 2
MAXIMUM RATINGS (TA = 25C)
Rating Reverse Voltage Peak Reverse Voltage Forward Current Peak Forward Current Peak Forward Surge Current (Note 1) Symbol VR VRM IF IFM IFSM Value 80 80 100 300 2.0 Unit Vdc Vdc mAdc mAdc Adc
1
SC-75/SOT-416 CASE 463 STYLE 3
THERMAL CHARACTERISTICS
Characteristic Power Dissipation Junction Temperature Storage Temperature Range Symbol PD TJ Tstg Max 150 150 -55 to +150 Unit mW C/W C 1 N9 = Specific Device Code M = Date Code* G = Pb-Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. N9 M G G
MARKING DIAGRAM
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. t = 1 mS
ORDERING INFORMATION
Device DAN222 DAN222G Package Shipping
SC-75/SOT-416 3000/Tape & Reel SC-75/SOT-416 3000/Tape & Reel (Pb-Free) SC-75/SOT-416 3000/Tape & Reel SC-75/SOT-416 3000/Tape & Reel (Pb-Free)
DAN222T1 DAN222T1G
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
(c) Semiconductor Components Industries, LLC, 2006
1
March, 2006 - Rev. 4
Publication Order Number: DAN222/D
DAN222
ELECTRICAL CHARACTERISTICS (TA = 25C)
Characteristic Reverse Voltage Leakage Current Forward Voltage Reverse Breakdown Voltage Diode Capacitance Reverse Recovery Time 2. trr Test Circuit on following page. Symbol IR VF VR CD trr(2) Condition VR = 70 V IF = 100 mA IR = 100 mA VR = 6.0 V, f = 1.0 MHz IF = 5.0 mA, VR = 6.0 V, RL = 100 W, Irr = 0.1 IR Min - - 80 - - Max 0.1 1.2 - 3.5 4.0 Unit mAdc Vdc Vdc pF ns
TYPICAL ELECTRICAL CHARACTERISTICS
100 IF, FORWARD CURRENT (mA) TA = 85C 10 TA = -40C IR , REVERSE CURRENT (A) 10 TA = 150C TA = 125C
1.0
0.1
TA = 85C TA = 55C
1.0
TA = 25C
0.01 TA = 25C 0 10 20 30 40 VR, REVERSE VOLTAGE (VOLTS) 50
0.1
0.2
0.4
0.6 0.8 1.0 VF, FORWARD VOLTAGE (VOLTS)
1.2
0.001
Figure 1. Forward Voltage
1.0 CD, DIODE CAPACITANCE (pF)
Figure 2. Reverse Current
0.9
0.8
0.7
0.6
0
2
4
6
8
VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Diode Capacitance
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2
DAN222
tr
tp t 10% IF
trr t
A
RL 90% VR tp = 2 ms tr = 0.35 ns
Irr = 0.1 IR IF = 5.0 mA VR = 6 V RL = 100 W
RECOVERY TIME EQUIVALENT TEST CIRCUIT
INPUT PULSE
OUTPUT PULSE
Figure 4. Reverse Recovery Time Test Circuit for the DAN222
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3
DAN222
PACKAGE DIMENSIONS
SC-75/SOT-416 CASE 463-01 ISSUE F
-E-
2 3
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. MILLIMETERS MIN NOM MAX 0.70 0.80 0.90 0.00 0.05 0.10 0.15 0.20 0.30 0.10 0.15 0.25 1.55 1.60 1.65 0.70 0.80 0.90 1.00 BSC 0.10 0.15 0.20 1.50 1.60 1.70 INCHES NOM 0.031 0.002 0.008 0.006 0.063 0.031 0.04 BSC 0.004 0.006 0.061 0.063 MIN 0.027 0.000 0.006 0.004 0.059 0.027
e
1
-D-
b 3 PL 0.20 (0.008)
M
D
HE
0.20 (0.008) E
DIM A A1 b C D E e L HE
MAX 0.035 0.004 0.012 0.010 0.067 0.035 0.008 0.065
C
A L A1
STYLE 3: PIN 1. ANODE 2. ANODE 3. CATHODE
SOLDERING FOOTPRINT*
0.356 0.014
1.803 0.071
0.787 0.031
0.508 0.020
1.000 0.039
SCALE 10:1 mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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4
DAN222/D

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